Testing | Kaufetronics

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TESTING

Testing

At Kaufetronics S.R.O., we specialize in providing thorough and reliable testing services for electronic components. Our state-of-the-art facilities and experienced team ensure that your components meet the highest standards of quality and performance.

Functional Testing

Functional testing involves verifying that the key functions of a chip operate correctly according to the device’s data manual. This type of testing focuses on major functions rather than all possible functions, as it is impractical to test every single function of a chip. No testing company can feasibly test all functions. Successfully passing the main functional tests indicates that the chip is likely to be in good working condition. Functional testing assesses the internal circuitry, offering higher accuracy compared to electrical performance testing.

Electrical Testing

Electrical testing encompasses various assessments such as pin-open circuit testing, short circuit testing, leakage testing, pin matching testing, and breakdown testing. It is distinct from power testing. Power-on testing involves powering the chip to check for large current phenomena, primarily identifying power supply and ground short circuits, but it does not reveal other issues. Electrical performance testing is more precise than power testing. However, electrical testing only evaluates the pins without testing the internal circuitry, resulting in lower accuracy compared to functional testing.

Decapsulation Testing

Decapsulation testing is a destructive method that involves opening the chip to inspect the internal die. This type of testing may not always determine the model, as some manufacturers include a logo and model number, while others may have no markings or use coded model numbers. If the model is not visible on the surface, decapsulation testing can be attempted to identify the model, but it is not guaranteed that all chips will reveal this information.

Visual Inspection

Visual inspection involves several checks, including acetone testing to detect re-typed screen printing, examining the chip surface for re-polishing or black glue coverage, and assessing the condition of the chip’s pins for rearrangement or replacement. It also includes checking for overall chip defects, verifying the accuracy of the chip’s positioning holes, and ensuring the chip size is within specifications. The conclusion of a visual inspection does not determine whether the chip is refurbished or original. The more thorough the visual inspection, the more accurate the assessment.

X-Ray Inspection

X-ray inspection is a non-destructive method used to detect the IC bonding wires and check for the presence of moisture within the die. It does not reveal the logo or markings on the surface of the wafer.

RoHS Detection

RoHS testing is conducted according to international standards to detect six major hazardous substances. The standards are as follows:
– Cadmium (Cd) limit: 100 ppm
– Lead (Pb), mercury (Hg), hexavalent chromium (Cr (VI)), polybrominated biphenyls (PBBs), and polybrominated diphenyl ethers (PBDEs): 1000 ppm each
Typically, most customers are primarily concerned with whether the lead content exceeds the standard.

Solderability Testing

Solderability testing verifies whether the chip pins can be tinned and ensures that the tinning coverage is greater than or equal to 95%. Chips with slight oxidation can still be tinned normally. However, severe oxidation, blackened pins, or glue on the pin surface may result in failed solderability testing. It is important to note that solderability testing is a destructive process, and the chip will be damaged afterward.

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